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Solving the multi-objective quadratic assignment problem using a fast messy genetic algorithm

PROCEEDINGS ARTICLE published in The 2003 Congress on Evolutionary Computation, 2003. CEC '03.

Authors: R.O. Day | M.P. Kleeman | G.B. Lamont

Printed circuit board EMI source mechanisms

PROCEEDINGS ARTICLE published in 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)

Authors: T.H. Hubing

The structure and analysis of coreless printed circuit board transformers

PROCEEDINGS ARTICLE published 2003 in 6th International SYmposium on Antennas, Propagation and EM Theory, 2003. Proceedings. 2003

Surface breakdown of printed circuit board under dc magnetic field

PROCEEDINGS ARTICLE published in 2003 Annual Report Conference on Electrical Insulation and Dielectric Phenomena

Authors: B.X. Du

Filters with inductance cancellation using printed circuit board transformers

PROCEEDINGS ARTICLE published in IEEE 34th Annual Conference on Power Electronics Specialist, 2003. PESC '03.

Authors: T.C. Neugebauer | D.J. Perreault

Ruin and Recreate Principle Based Approach for the Quadratic Assignment Problem

BOOK CHAPTER published 2003 in Genetic and Evolutionary Computation — GECCO 2003

Authors: Alfonsas Misevicius

Suppression effect of the emission from printed circuit board using magnetic absorber located along microstrip line

PROCEEDINGS ARTICLE published 2003 in 2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03.

Authors: T. Tobana | T. Sasamori | K. Abe | K. Sawaya

Modeling and simulation of printed circuit board drop test

PROCEEDINGS ARTICLE published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)

Authors: Y.Q. Wang | K.H. Low | F.X. Che | H.L.J. Pang | S.P. Yeo

Estimation of printed circuit board ground plane net partial inductance via noise voltage measurements

PROCEEDINGS ARTICLE published in 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)

Authors: F.B.J. Leferink | W.C. van Etten

Effects of Boundary Conditions and Source Dimensions on the Effective Thermal Conductivity of a Printed Circuit Board

PROCEEDINGS ARTICLE published 1 January 2003 in 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2

Authors: Younes Shabany

Thermal Management of QFN 48 Package Attached to Different Multi-Layers of Printed Circuit Board Designs

PROCEEDINGS ARTICLE published 1 January 2003 in 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2

Authors: John Chia | Charles Yang

Equivalence of two calculation methods for common-mode excitation on a printed circuit board with narrow ground plane

PROCEEDINGS ARTICLE published in 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446)

Authors: T. Watanabe | M. Kishimoto | S. Matsunaga | T. Tanimoto | R. Koga | O. Wada | A. Namba